Development of Strength Evaluation Method for Thin Plate Adhesively Bonded Joints under Mixed Mode Conditions.

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ژورنال

عنوان ژورنال: TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A

سال: 1995

ISSN: 0387-5008,1884-8338

DOI: 10.1299/kikaia.61.823